SID Technologies designs, develops, manufactures and sales innovative modular microsystem with customized technical solutions.SID Technologies developing modular drive, power, signal acquisition and transceiver components by breakthrough SIP and MCM package technology which reducing the size of traditional PCB board. SID Technologies sells products to multiple application including wireless networking and communication, broadcast video, new energy vehicles, automation and oil prospecting market.

Headquartered and design center base on Hong Kong, SID have a top technical team involves microelectronics industry experts. Our sales engineers in Beijing and Shenzhen sales offices are trained across all SID products and give the most suitable technical solutions to our customers.